Wevo Launches New Series of Encapsulation Resins for Electronic Components

According to foreign media reports, Wevo, a developer of custom encapsulants, adhesives, and sealants, has announced the launch of three new encapsulation resins: WEVOSIL 22106 FL, 22102 FL, and 22105 FL. These resins feature an ultra-soft texture that effectively withstands mechanical stress. They also provide efficient thermal management and are optimized to ensure reliable encapsulation. The materials offer solutions for various modern electronic components, including wire-bonded elements and inductive components such as inductors or transformers, regardless of whether they have ferrite cores. The hardness of Wevo's WEVOSIL 2210x series electroplated resins is approximately Shore 60 degrees, and they exhibit a super-soft texture after curing. This allows them to excellently suppress stress from vibrations or impacts. Additionally, thanks to advanced fillers, these three encapsulants combine all the advantages of thermally conductive silicone, including excellent adhesion and a break elongation rate of over 100%. There are three types, each with different thermal conductivities.