2025 Qualcomm Automotive Technology and Cooperation Summit Held in Suzhou

The 2025 Qualcomm Automotive Technology and Cooperation Summit was grandly held in Suzhou from June 26 to 27. The summit, themed "Together, We Move Steady and Smartly Forward," showcased comprehensive intelligent automotive stack technologies, industry chain ecosystems, and full-scenario experiences. As a long-term strategic partner of Qualcomm, Quectel participated deeply in the summit with its full-stack automotive intelligent solutions. Wang Min, General Manager of Quectel's Automotive Division, delivered a keynote speech at the main forum, sharing practical paths for the intelligent cockpit transformation driven by AI large models. In his speech at the summit, Meng Pu, Chairman of Qualcomm China, emphasized Qualcomm's unique full-stack layout, global advantages, and firm strategic execution in continuously deepening its automotive sector engagement. Looking ahead, Qualcomm will focus on "Connectivity + Computing + AI" to promote the transition of automobiles from "mechanical engineering products" to "intelligent mobile terminals." Wang Min reflected on the ten-year collaboration between Qualcomm and Quectel, highlighting milestones from the 2016 launch of the first car-grade LTE module AG35 to the current powerful combination of high-performance SoC + 5G, showcasing their joint contributions through multiple generational revolutions in the automotive sector. The cooperation covers various areas of automotive intelligence, serving over 40 mainstream car manufacturers and more than 60 Tier 1 suppliers worldwide. Facing the historic opportunity of AI large models accelerating into vehicles, Wang Min pointed out that intelligent cockpits are transitioning from "function integration" to a new era of "emotional interaction." He explained, "As cars evolve from mere transportation tools into a 'third living space,' users need not just a stack of functions, but a smart partner that understands their needs and anticipates scenarios." He elaborated that this requires cockpits to possess capabilities for continuous learning and proactive care, with AI large models serving as the key to unlock this transformation. Quectel's professional AS830M 5G intelligent cockpit module, based on Qualcomm's Snapdragon 8 Gen 2 platform, demonstrates outstanding CPU, GPU, and AI computing performance, featuring an 8-core Kryo 64-bit processor with a computing power of 200K DMIPS and an Adreno 740 GPU providing 2T FLOPS computing power. Its independent NPU unit elevates AI comprehensive computing capabilities to 48 TOPS (INT8), enabling efficient processing of machine vision, voice audio, natural language, and multimodal model verification. In addition to the AS830M, Quectel has developed the luxury-grade AS900P 5G intelligent cockpit module based on Qualcomm's latest SoC platform, utilizing 3nm N3P process technology to deliver up to 60 TOPS of ultra-high AI computing power, 300K DMIPS CPU performance, and 4.0T FLOPS GPU capabilities. It supports 5G R18 communication and Wi-Fi 7, achieving the first deployment of mainstream large models like DeepSeek, Qwen, and Llama at the edge, empowering the cockpit with dynamic trip planning, multimodal voice interaction, and scenario-based proactive service capabilities. This module continuously learns user preferences, creating a personalized intelligent cockpit ecosystem, akin to equipping the vehicle with a "thinking brain." Quectel's design integrates instrumentation, central control, AR-HUD, T-BOX, and parking systems on a single chip, utilizing LXC container and Hypervisor virtualization technology to ensure functional safety isolation and system efficiency and stability, akin to providing "independent bodyguards" for each function. This guarantees system efficiency and stability while providing a crucial technological foundation for integrated cockpit and parking systems. The module is set to enter sample production. Leveraging over a decade of experience in automotive front-end solutions, Quectel has built a comprehensive cockpit connectivity support system covering both hardware and software. On the software side, its self-developed QuecOpen connectivity platform boasts excellent cross-platform and cross-system compatibility, facilitating seamless system migration for car manufacturers and significantly reducing development cycles. The DynaBlue Bluetooth protocol stack has achieved high stability mass production in leading car manufacturers after passing LE Audio 5.4 certification. On the hardware side, the pin-to-pin compatible design allows evolution across high, mid, and entry-level platform project results. Quectel's vehicle cellular antenna compensation technology addresses the challenge of signal attenuation in weak network environments, significantly enhancing communication stability. Quectel excels in hardware design, with its PI/SI simulation team efficiently executing simulations and optimizations to quickly achieve optimal hardware designs. The thermal design team provides board-level and system-level thermal simulation analysis services, delivering detailed simulation reports and heat dissipation optimization suggestions. The automotive antenna team, with extensive RF debugging experience, supports the delivery of millions of vehicle cellular, Wi-Fi, and GNSS modules. Quectel has accumulated mature experience in SIP and BGA ball planting, underfill, and other processes, significantly reducing the complexity of automotive hardware design. Looking to the future, Quectel will continue to deepen its cooperation with Qualcomm, increase R&D and investment in the automotive sector, and consistently explore innovative technologies and solutions. Both parties will collaboratively address challenges in the automotive intelligence process, continuously optimize products and technologies, provide more cutting-edge automotive products and services for global car manufacturers, lead innovations in intelligent cockpit technologies, deeply explore the interactive potential of the "third living space," and create a safer and more immersive smart travel experience for drivers and passengers, propelling the smart connected vehicle industry to new heights.